저널
N.-Y. Choi, S.-U. Zhang
Numerical evaluation of radiation degradation for P-MOSFET power devices under total ionizing dose effect
N.-Y. Choi, D.-H. Kim, Sangmin Nam, Y.-J. Lee, S.-U. Zhang
A Benchmarking Study on IGBT Thermal-Electrical Performance Using Finite Element Analysis and Design of Experiments (DOE)
D.-H. Kim, D.-S. Kim, S.-U. Zhang
Classifying Radiation Degradation of Epoxy Molding Compound by Using Machine Learning and its Effect on Thermal and Mechanical Properties
S.-M. Nam, S.-U. Zhang
Comparative Thermo-electric Analysis of Void and Wire Diameter Variation for Two Packages TO-251 and TO-252 Using Die-attach Sintered Ag
The Transactions of the Korean Institude of Electrical Engineers, vol. 73, no. 8, pp.1344-1350, 2024
DOI: 10.5370/KIEE.2024.73.8.1344
S.-M. Nam, Y.-H. Kim, S.-U. Zhang
Bicycle Frame Design Using a Customized Bicycle Design Tool and Structural Analysis
Journal of the Korean Society of Manufacturing Process Engineers, vol. 23, no. 7, pp. 38-44, 2024
DOI: 10.14775/ksmpe.2024.23.07.038
D.-H. Kim, S.-U. Zhang
A Study on a Model for Determining the Cause of Gantry Crane Gearbox Failures Using Machine Learning and Design of Experiments
Journal of the Korean Society of Manufacturing Process Engineers, vol. 23, no. 2, pp.1-7, 2024
DOI: 10.14775/ksmpe.2024.23.2.001
N.-Y. Choi, S.-U. Zhang
Numerical Analysis of Cu Clip and Al Wire Bonding for MOSFET Packaging
The Transactions of the Korean Institude of Electrical Engineers, vol. 73, no. 2, pp. 320-326, 2024
DOI: 10.5370/KIEE.2024.73.2.320
N.-Y. Choi, S.-U. Zhang
Terminal strength test of TO-220 packaged Schottky barrier diode using
finite element method
S.-U. Zhang, O. Seok
Chip packaging interaction of SiC junction barrier Schottky diode packages
D.-H. Kim, S.-W. Choe, S.-U. Zhang
Recognition of adherent polychaetes on oysters and scallops using Microsoft Azure Custom Vision
V. Mudeng, G. Ayana, S.-U. Zhang, Se-woon Choe
Progress of Near-Infrared-Based Medical Imaging and Cancer Cell Suppressors
H.-H. Park, S.-U. Zhang
Learning effect of CAE Class using PBL
Journal of the Korea Institute of Information and Communication Engineering,, 2022
DOI: 10.6109/jkiice.2022.26.6.922
H.-H. Park, S.-U. Zhang
Study of Flipped Learning-based PBL Teaching in 3D CAD Class
Journal of the Korea Institute of Information and Communication Engineering, Vol. 26, No. 5, pp. 779-785, 2022
DOI: 10.6109/jkiice.2022.26.5.779
N.-Y. Choi, S.-U. Zhang
Numerical Evaluation of Thermal Resistance for Power MOSFET Packaged in Hermetic Method
Journal of Electrical Engineering & Technology, Vol. 17, No.3, pp.1915-1920, 2022
DOI: 10.1007/s42835-022-01013-6
S.-U. Zhang
Classifying Thermal Degradation of Polylactic Acid by Using Machine Learning Algorithms Trained on Fourier Transform Infrared Spectroscopy Data
N.-Y. Choi, S.-U. Zhang
A Comparative Study of the Linear-elastic and Hyperelastic Models for Degradation of PLA Prepared using Fused Filament Fabrication
Journal of the Korean Society of Manufacturing Process Engineers, vol. 19, no. 5, pp. 1–7, 2020
DOI: 10.14775/ksmpe.2020.19.03.001
H.-J. Yoo, S.-U. Zhang, S.-J. Jung
Big Data Analysis on Oyster Growth and FLUPSY Environment
Journal of the Korean Society of Manufacturing Process Engineers, vol. 19, no. 7, pp. 106–111, 2020
DOI: 10.14775/ksmpe.2020.19.07.106
S.-U. Zhang
Classifying Degraded Three-Dimensionally Printed Polylactic Acid Specimens Using Artificial Neural Networks based on Fourier Transform Infrared Spectroscopy
S.-U. Zhang
Degradation Classification of 3D Printing Thermoplastics Using Fourier Transform Infrared Spectroscopy and Artificial Neural Networks
K.-S. Seol, P. Zhao, B.-C. Shin, S.-U. Zhang
Infill Print Parameters for Mechanical Properties of 3D Printed PLA Parts
Journal of the Korean Society of Manufacturing Process Engineers, vol. 17, no. 4, pp. 9–16, 2018
DOI: 10.14775/ksmpe.2018.17.4.009
K.-S. Seol, B.-C. Shin, S.-U. Zhang
Fatigue Test of 3D-printed ABS Parts Fabricated by Fused Deposition Modeling
Journal of the Korean Society of Manufacturing Process Engineers, vol. 17, no. 3, pp. 93–101, 2018
DOI: 10.14775/ksmpe.2018.17.3.093
S.-U. Zhang
Numerical evaluation of ABS parts fabricated by fused deposition modeling and vapor smoothing
Advances in Science, Technology and Engineering Systems Journal, vol. 2, no. 6, pp. 157–161, 2017
DOI: 10.25046/aj020620
S.-U. Zhang, J.H. Han, H.-W. Kang
Temperature-dependent mechanical properties of ABS parts fabricated by fused deposition modeling and vapor smoothing
International Journal of Precision Engineering and Manufacturing, vol. 18, no. 5, pp. 763–769, 2017
DOI: 10.1007/s12541-017-0091-7
S.-U. Zhang
Chip package interaction for LED packages
S.-U. Zhang
Quantification of silicone degradation for LED packages using finite element analysis
Microelectronics Reliability, vol. 55, no. 12, pp. 2678–2684, 2015
DOI: 10.1016/j.microrel.2015.09.006
S.-U. Zhang, B.W. Lee
Fatigue life evaluation of wire bonds in LED packages using numerical analysis,
Microelectronics Reliability, vol. 54, no. 12, pp. 2853–2859, 2014
DOI: 10.1016/j.microrel.2014.07.142
S.-U. Zhang, A.V. Kumar
Inverse method for estimating resistivity of carbon fiber composite structures
Journal of Engineering Materials and Technology, Transactions of the ASME, vol. 133, no. 1, pp. 1–6, 2011
DOI: 10.1115/1.4002627
S.-U. Zhang, A.V. Kumar
Three-dimensional magnetostatic analysis using structured mesh and nodal elements
S.-U. Zhang, A.V. Kumar
Magnetostatic Analysis Using Implicit Boundary Finite -Element Method
R.J. Sadleir, S.-U. Zhang, A.S. Tucker, S.H. Oh,
Imaging and quantification of anomaly volume using an eight-electrode "hemiarray" EIT reconstruction method
R.J. Sadleir, S. Grant, S.-U. Zhang, S.H. Oh, B.I. Lee, E.J. Woo
High field MREIT: Setup and tissue phantom imaging at 11 T
R.J. Sadleir, S. Grant, S.-U. Zhang, B.I. Lee, H.C. Pyo, S.H. Oh, C. Park, E.J. Woo, S.Y. Lee, O. Kwon, J.K. Seo
Noise analysis in magnetic resonance electrical impedance tomography at 3 and 11 T field