저널 컨퍼런스 챕터
저널
N.-Y. Choi, S.-U. Zhang
Terminal strength test of TO-220 packaged Schottky barrier diode using finite element method
Microelectronics Reliability, 2023   DOI: 10.1016/j.microrel.2023.115235
S.-U. Zhang, O. Seok
Chip packaging interaction of SiC junction barrier Schottky diode packages
Energy Reports, Vol.9, Supplement 4, Pages 65-77, 2023   DOI: 10.1016/j.egyr.2023.02.070
D.-H. Kim, S.-W. Choe, S.-U. Zhang
Recognition of adherent polychaetes on oysters and scallops using Microsoft Azure Custom Vision
Electronic Research Archive, 2023   DOI: 10.3934/era.2023088
V. Mudeng, G. Ayana, S.-U. Zhang, Se-woon Choe
Progress of Near-Infrared-Based Medical Imaging and Cancer Cell Suppressors
Chemosensors, 2022   DOI: 10.3390/chemosensors10110471
H.-H. Park, S.-U. Zhang
Learning effect of CAE Class using PBL
Journal of the Korea Institute of Information and Communication Engineering,, 2022   DOI: 10.6109/jkiice.2022.26.6.922
H.-H. Park, S.-U. Zhang
Study of Flipped Learning-based PBL Teaching in 3D CAD Class
Journal of the Korea Institute of Information and Communication Engineering, Vol. 26, No. 5, pp. 779-785, 2022   DOI: 10.6109/jkiice.2022.26.5.779
N.-Y. Choi, S.-U. Zhang
Numerical Evaluation of Thermal Resistance for Power MOSFET Packaged in Hermetic Method
Journal of Electrical Engineering & Technology, Vol. 17, No.3, pp.1915-1920, 2022   DOI: 10.1007/s42835-022-01013-6
S.-U. Zhang
Classifying Thermal Degradation of Polylactic Acid by Using Machine Learning Algorithms Trained on Fourier Transform Infrared Spectroscopy Data
Applied Sciences, vol. 10, no. 21, pp. 1–13, 2020, 2020   DOI: 10.3390/app10217470
N.-Y. Choi, S.-U. Zhang
A Comparative Study of the Linear-elastic and Hyperelastic Models for Degradation of PLA Prepared using Fused Filament Fabrication
Journal of the Korean Society of Manufacturing Process Engineers, vol. 19, no. 5, pp. 1–7, 2020   DOI: 10.14775/ksmpe.2020.19.03.001
H.-J. Yoo, S.-U. Zhang, S.-J. Jung
Big Data Analysis on Oyster Growth and FLUPSY Environment
Journal of the Korean Society of Manufacturing Process Engineers, vol. 19, no. 7, pp. 106–111, 2020   DOI: 10.14775/ksmpe.2020.19.07.106
S.-U. Zhang
Classifying Degraded Three-Dimensionally Printed Polylactic Acid Specimens Using Artificial Neural Networks based on Fourier Transform Infrared Spectroscopy
Applied Sciences, vol. 9, no. 13, p. 2772, 2019   DOI: 10.3390/app9132772
S.-U. Zhang
Degradation Classification of 3D Printing Thermoplastics Using Fourier Transform Infrared Spectroscopy and Artificial Neural Networks
Applied Sciences, vol. 8, no. 8, 2018   DOI: 10.3390/app8081224
K.-S. Seol, P. Zhao, B.-C. Shin, S.-U. Zhang
Infill Print Parameters for Mechanical Properties of 3D Printed PLA Parts
Journal of the Korean Society of Manufacturing Process Engineers, vol. 17, no. 4, pp. 9–16, 2018   DOI: 10.14775/ksmpe.2018.17.4.009
K.-S. Seol, B.-C. Shin, S.-U. Zhang
Fatigue Test of 3D-printed ABS Parts Fabricated by Fused Deposition Modeling
Journal of the Korean Society of Manufacturing Process Engineers, vol. 17, no. 3, pp. 93–101, 2018   DOI: 10.14775/ksmpe.2018.17.3.093
S.-U. Zhang
Numerical evaluation of ABS parts fabricated by fused deposition modeling and vapor smoothing
Advances in Science, Technology and Engineering Systems Journal, vol. 2, no. 6, pp. 157–161, 2017   DOI: 10.25046/aj020620
S.-U. Zhang, J.H. Han, H.-W. Kang
Temperature-dependent mechanical properties of ABS parts fabricated by fused deposition modeling and vapor smoothing
International Journal of Precision Engineering and Manufacturing, vol. 18, no. 5, pp. 763–769, 2017   DOI: 10.1007/s12541-017-0091-7
S.-U. Zhang
Chip package interaction for LED packages
Microelectronics Reliability, vol. 63, pp. 76–81, 2016   DOI: 10.1016/j.microrel.2016.06.014
S.-U. Zhang
Quantification of silicone degradation for LED packages using finite element analysis
Microelectronics Reliability, vol. 55, no. 12, pp. 2678–2684, 2015   DOI: 10.1016/j.microrel.2015.09.006
S.-U. Zhang, B.W. Lee
Fatigue life evaluation of wire bonds in LED packages using numerical analysis,
Microelectronics Reliability, vol. 54, no. 12, pp. 2853–2859, 2014   DOI: 10.1016/j.microrel.2014.07.142
S.-U. Zhang, A.V. Kumar
Inverse method for estimating resistivity of carbon fiber composite structures
Journal of Engineering Materials and Technology, Transactions of the ASME, vol. 133, no. 1, pp. 1–6, 2011   DOI: 10.1115/1.4002627
S.-U. Zhang, A.V. Kumar
Three-dimensional magnetostatic analysis using structured mesh and nodal elements
IEEE Transactions on Magnetics, no. 1 PART 2, pp. 198–206, 2011   DOI: 10.1109/TMAG.2010.2086064
S.-U. Zhang, A.V. Kumar
Magnetostatic Analysis Using Implicit Boundary Finite -Element Method
IEEE Transactions on Magnetics, vol. 46, no. 5, pp. 1159–1166, 2010   DOI: 10.1109/TMAG.2009.2039940
R.J. Sadleir, S.-U. Zhang, A.S. Tucker, S.H. Oh,
Imaging and quantification of anomaly volume using an eight-electrode "hemiarray" EIT reconstruction method
Physiological Measurement, vol. 29, no. 8, pp. 913–927, 2008   DOI: 10.1088/0967-3334/29/8/005
R.J. Sadleir, S. Grant, S.-U. Zhang, S.H. Oh, B.I. Lee, E.J. Woo
High field MREIT: Setup and tissue phantom imaging at 11 T
Physiological Measurement, 2006   DOI: 10.1088/0967-3334/27/5/S22
R.J. Sadleir, S. Grant, S.-U. Zhang, B.I. Lee, H.C. Pyo, S.H. Oh, C. Park, E.J. Woo, S.Y. Lee, O. Kwon, J.K. Seo
Noise analysis in magnetic resonance electrical impedance tomography at 3 and 11 T field
Physiological Measurement, 2005   DOI: 10.1088/0967-3334/26/5/023
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